Failure Analysis Course

A broad range of failure analysis and reliability issues are covered in this course. The program is based on IPC, ANSI, ASM, ASTM, ISTFA, EDFAS, and IEEE test methods and specifications. 

Participants will gain exposure to the following:

Scanning electron microscopy (SEM) Optical microscopy 
Decapsulation of integrated circuits 
Probe station and micro-probing of circuits
RF plasma etching
Scanning Acoustic Microscopy (SAM) 
Fourier Transform Infrared Spectroscopy (FTIR) 
Transmission X-ray 
Differential Scanning Calorimetry (DSC) 
Shear / pull testing 
Solderability Testing 
X-ray fluorescence (XRF)

Lead-free issues and analysis techniques are reviewed.

Conference

Disaster Preparedness and Recovery 
June 8-10, 2006 
Queens College, City University of New York 
Flushing (New York City), NY, U.S.A 
Sponsored by IEEE Society on Social Implications of Technology